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3403.0277.23

Fuse Chip Slow Blow Acting 2A 277V SMD Solder Pad 16 X 5.3mm Ceramic Blister T/R


  • Manufacturer: Schurter Inc.
  • Origchip NO: 685-3403.0277.23
  • Package: 2-SMD, Square End Block
  • Datasheet: PDF
  • Stock: 145
  • Description: Fuse Chip Slow Blow Acting 2A 277V SMD Solder Pad 16 X 5.3mm Ceramic Blister T/R(Kg)

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Details

Tags

Parameters
Factory Lead Time 29 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 2-SMD, Square End Block
Weight 1.200007g
Body Material Ceramic
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Series UMT-H
Size / Dimension 0.606Lx0.211W x 0.211 H 15.40mmx5.35mmx5.35mm
JESD-609 Code e2
Part Status Active
Moisture Sensitivity Level (MSL) Vendor Undefined
ECCN Code EAR99
Voltage - Rated DC 250V
Packing Method TAPE AND REEL
Depth 5.35mm
Reach Compliance Code not_compliant
Current Rating 2A
Reference Standard UL; VDE
Voltage - Rated AC 277V
Approval Agency cURus, VDE
Body Length or Diameter 15.4mm
Physical Dimension 15.4mm x 5.35mm x 5.35mm
Power Dissipation 795mW
Response Time Slow Blow
Fuse Type Board Mount (Cartridge Style Excluded)
Breaking Capacity @ Rated Voltage 1.5kA
Melting I2t 11.8
Circuit Protection Type ELECTRIC FUSE
Blow Characteristic TIME LAG
Fuse Current 2A
Height 5.35mm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
See Relate Datesheet
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