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1SX250LN3F43I2VG

-40°C~100°C TJ System On ChipStratix? 10 SX Series 688 I/O

Manufacturer: Intel
Origchip NO: 386-1SX250LN3F43I2VG
Package: 1760-BBGA, FCBGA
Datasheet: PDF
Stock: 928
Description: -40°C~100°C TJ System On ChipStratix? 10 SX Series 688 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	12 Weeks
Package / Case	1760-BBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	Stratix® 10 SX
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of I/O	688
Speed	1.5GHz
RAM Size	256KB
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR CIRCUIT
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Peripherals	DMA, WDT
Connectivity	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	FPGA - 2500K Logic Elements
RoHS Status	RoHS Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).

A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight? is used to build this SoC.It has been assigned a package 1760-BBGA, FCBGA by its manufacturer for this system on a chip.A 256KB RAM SoC chip provides reliable performance to users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.In the Stratix? 10 SX series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines FPGA - 2500K Logic Elements.In the state-of-the-art Tray package, this SoC system on a chip is housed.688 I/Os are included in this SoC part.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.