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10AS027E2F29I1HG

-40°C~100°C TJ System On ChipArria 10 SX Series 360 I/O

Manufacturer: Intel
Origchip NO: 386-10AS027E2F29I1HG
Package: 780-BBGA, FCBGA
Datasheet: PDF
Stock: 792
Description: -40°C~100°C TJ System On ChipArria 10 SX Series 360 I/O(Kg)

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Details

Tags

Parameters
Package / Case	780-BBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	Arria 10 SX
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of I/O	360
Speed	1.5GHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA, POR, WDT
Connectivity	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	FPGA - 270K Logic Elements
RoHS Status	RoHS Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).

Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC is built.According to the manufacturer, this system on a chip has a package of 780-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Arria 10 SX series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 270K Logic Elements.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.360 I/Os are included in this SoC part.