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0097055008

0097055008 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at XINJIADA

Manufacturer: Laird Technologies EMI
Origchip NO: 445-0097055008
Package: -
Datasheet: -
Stock: 828
Description: 0097055008 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at XINJIADA(Kg)

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Details

Tags

Parameters
Factory Lead Time	4 Weeks
Material	Beryllium Copper
Operating Temperature	121°C
Series	Twist
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Type	Fingerstock
Plating	Tin
Attachment Method	Adhesive
Height	0.030 0.76mm
Length	24.000 609.60mm
Width	0.230 5.84mm
Plating Thickness	299.21μin 7.60μm
Thickness	76.2μm
RoHS Status	RoHS Compliant

0097055008 Overview

Materials from Beryllium Copper are used in Contact RFI packaging.121°C is a valid operating temperature for the EMI/RFI.A contacter RFI with the Fingerstock type.The RFI EMI is a kind of the well-known Twist series of products.