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0078001002

0078001002 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at XINJIADA

Manufacturer: Laird Technologies EMI
Origchip NO: 445-0078001002
Package: -
Datasheet: -
Stock: 155
Description: 0078001002 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at XINJIADA(Kg)

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Details

Tags

Parameters
Factory Lead Time	4 Weeks
Material	Beryllium Copper
Operating Temperature	121°C
Series	Ultrasoft Slot Mount
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Type	Fingerstock
Attachment Method	Slot
Height	0.110 2.79mm
Length	16.000 406.40mm
Width	0.320 8.13mm
Thickness	101.6μm
RoHS Status	RoHS Compliant

0078001002 Overview

Materials from Beryllium Copper are used in Contact RFI packaging.When the temperature is 121°C, EMI/RFI can work normally.Fingerstock Type from the contacter RFI.The RFI EMI is a kind of the well-known Ultrasoft Slot Mount series of products.