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HC5513BIM

28 TerminationsTelecom device1 Circuits1 Functions

Manufacturer: Intersil (Renesas Electronics America)
Origchip NO: 391-HC5513BIM
Package: DIP
Datasheet: PDF
Stock: 320
Description: 28 TerminationsTelecom device1 Circuits1 Functions(Kg)

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Details

Tags

Parameters
Mount	Through Hole
Package / Case	DIP
Published	2000
JESD-609 Code	e0
Moisture Sensitivity Level (MSL)	1
Number of Terminations	28
Terminal Finish	Tin/Lead (Sn/Pb)
Max Operating Temperature	85°C
Min Operating Temperature	-40°C
Subcategory	Analog Transmission Interfaces
Technology	BIPOLAR
Terminal Position	QUAD
Terminal Form	J BEND
Peak Reflow Temperature (Cel)	225
Number of Functions	1
Supply Voltage	5V
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	S-PQCC-J28
Qualification Status	Not Qualified
Power Supplies	+-5V
Temperature Grade	INDUSTRIAL
Number of Circuits	1
Power Dissipation-Max	1.5W
Operating Supply Current	2.25mA
Telecom IC Type	SLIC
Neg Supply Voltage-Nom	-5V
Battery Feed	CONSTANT CURRENT
Hybrid	2-4 CONVERSION
Battery Supply	-28 V
Height Seated (Max)	4.57mm
RoHS Status	RoHS Compliant

HC5513BIM Overview

A DIP package saves space on a board.A 1-circuit composes this telecom IC .Through Hole is mounted on telecom switching.In telecom switching configuration, there are 28 terminations.It requires a supply voltage of 5V.Telecom ICs are of type SLIC.Designers have a great deal of flexibility with this telecom circuit due to its operation with the supply current provided by 2.25mA.In the Analog Transmission Interfaces subcategory, telecommunications device belongs.A minimum temperature value -40°C is set to ensure normal operation.It is necessary to set the temperature at the maximum value of 85°C for the telecom IC to function normally.Telecommunications device is configured wit h 1 functions when designing.